Stacked dual in-line package assembly

Details Stacked dual in-line package assembly Stacked dual in-line package assembly

1995-11-20

1998-05-19

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257686, 257692, 257696, 257777, 257797, 361735, 361732, 361790, 361803, 439 69, H05K 706, H01L 23544, H01L 2358, H01R 909

Patent

active

057544050

ABSTRACT:
Each flat package is provided with locking elements of snap fasteners that allow several packages to be assembled into a stack so as to align the leads of each package with respect to the leads of other packages. The leads projecting from both edges of the stack package assembly are inserted into a pair of PC boards having holes arranged so as to accommodate the leads of the assembly. The leads of the PC boards are inserted into a motherboard that carries the external conductors to be connected with the inner circuits of the package assembly.

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