Stacked-die package for battery power management

Details Stacked-die package for battery power management Stacked-die package for battery power management

2011-03-01

2011-03-01

Andújar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S734000, C257S666000, C257S686000, C257SE23058, C257SE25013

Reexamination Certificate

active

07898092

ABSTRACT:
A stacked-die package for battery protection is disclosed. The battery protection package includes a power control integrated circuit (IC) stacked on top of integrated dual common-drain metal oxide semiconductor field effect transistors (MOSFETs) or two discrete MOSFETs. The power control IC is either stacked on top of one MOSFET or on top of and overlapping both two MOSFETs.

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