Stacked device assembly with integrated coil and method of...

Inductor devices – Windings – Having conductor of particular shape

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C336S200000, C336S232000, C029S602100

Reexamination Certificate

active

07868729

ABSTRACT:
A stacked semiconductor device assembly (20) includes a device (24) having conductive traces (34) formed therein, and conductive interconnects (28) electrically connected to the conductive traces (34). Another device (26) has conductive traces (44) formed therein and device pads (54) formed on an outer surface (52) of the device (26). A method (120) entails attaching (84) a magnetic core (30) to an outer surface (42) of the device (24) and forming (92) the conductive interconnects (28) on the outer surface (42) using a stud bumping technique such that the interconnects (28) surround the magnetic core (30). The conductive interconnects (28) are coupled (126) with the device pads (54) using thermocompression bonding to couple the device (26) with the device (24) to form a continuous device coil (22) wrapped around the magnetic core (30) from an alternating electrical connection of the traces (34), the conductive interconnects (28), and the traces (44).

REFERENCES:
patent: 6724079 (2004-04-01), Viswanathan et al.
patent: 6844221 (2005-01-01), Viswanathan et al.
patent: 6998952 (2006-02-01), Zhou et al.
patent: 7132303 (2006-11-01), Wang et al.
patent: 7264986 (2007-09-01), Gogoi
patent: 7279795 (2007-10-01), Periaman et al.
patent: 7429798 (2008-09-01), Kim
patent: 2006/0214299 (2006-09-01), Fairchild et al.
patent: 2007/0257761 (2007-11-01), Mano et al.
patent: 2007/0268105 (2007-11-01), Walls
patent: 2008/0079115 (2008-04-01), Wang
patent: 2009/0115067 (2009-05-01), Okimoto et al.
patent: 2009/0146315 (2009-06-01), Shim et al.
patent: 2010/0007032 (2010-01-01), Gallegos
patent: 2010/0078828 (2010-04-01), Huang et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Stacked device assembly with integrated coil and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stacked device assembly with integrated coil and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stacked device assembly with integrated coil and method of... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2709965

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.