Inductor devices – Windings – Having conductor of particular shape
Reexamination Certificate
2011-01-11
2011-01-11
Mai, Anh T (Department: 2832)
Inductor devices
Windings
Having conductor of particular shape
C336S200000, C336S232000, C029S602100
Reexamination Certificate
active
07868729
ABSTRACT:
A stacked semiconductor device assembly (20) includes a device (24) having conductive traces (34) formed therein, and conductive interconnects (28) electrically connected to the conductive traces (34). Another device (26) has conductive traces (44) formed therein and device pads (54) formed on an outer surface (52) of the device (26). A method (120) entails attaching (84) a magnetic core (30) to an outer surface (42) of the device (24) and forming (92) the conductive interconnects (28) on the outer surface (42) using a stud bumping technique such that the interconnects (28) surround the magnetic core (30). The conductive interconnects (28) are coupled (126) with the device pads (54) using thermocompression bonding to couple the device (26) with the device (24) to form a continuous device coil (22) wrapped around the magnetic core (30) from an alternating electrical connection of the traces (34), the conductive interconnects (28), and the traces (44).
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D'Acosta Carl E.
Jen-Ho Wang James
Poarch Justin E.
Freescale Semiconductor Inc.
Mai Anh T
Meschkow & Gresham P.L.C.
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