Stacked circuit board assembly adapted for heat dissipation

Details Stacked circuit board assembly adapted for heat dissipation Stacked circuit board assembly adapted for heat dissipation

1998-10-28

1999-11-16

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361690, 361707, 361709, 361713, 361719, 361721, 165 802, 165 803, 165185, 174 163, 174 161, H05K 720

Patent

active

059868872

ABSTRACT:
An apparatus is provided for dissipating heat from a stacked circuit board assembly. The apparatus includes circuit boards that are oriented in spaced planes that extend substantially parallel to one another. A heat transfer means connected to the circuit boards transfers heat between the circuit boards. A heat dissipation means connected to at least one of the circuit boards dissipates at least a portion of the transferred heat.

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