Stacked chip connection using stand off stitch bonding

Details Stacked chip connection using stand off stitch bonding Stacked chip connection using stand off stitch bonding

2006-04-04

2006-04-04

Edmondson, Lynne R. (Department: 1725)

Metal fusion bonding

Process

Plural joints

C228S004500, C257S777000

Reexamination Certificate

active

07021520

ABSTRACT:
The present invention provides a structure, apparatus, and method for wire bonding in which a first wire bond is formed between first and second components, a second wire bond is formed between the second component and a third component such that the second wire bond is in electrical communication with the first wire bond, wherein the first and second wire bonds are connected to said first and second components, respectively, using ball bonding.

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