Fishing – trapping – and vermin destroying
Patent
1994-03-18
1996-02-20
Chaudhuri, Olik
Fishing, trapping, and vermin destroying
437 60, 437919, H01L 2170, H01L 2700
Patent
active
054928486
ABSTRACT:
A technique for making a MOST capacitor for use in a DRAM cell utilizes silicon nodules after metal etching. The silicon nodules are used as a mask to selectively form deep grooves in a polysilicon electrode of the capacitor.
REFERENCES:
patent: 4859622 (1989-08-01), Eguchi
patent: 5068199 (1991-11-01), Sandhu
patent: 5110752 (1992-05-01), Lu
patent: 5134086 (1992-07-01), Ahn et al.
patent: 5158905 (1992-10-01), Ahn
patent: 5164881 (1992-11-01), Ahn
patent: 5182232 (1993-06-01), Chhabra et al.
patent: 5204280 (1993-04-01), Dhong et al.
patent: 5213992 (1993-05-01), Lu
patent: 5227322 (1993-07-01), Ko et al.
patent: 5244842 (1993-09-01), Cathey et al.
patent: 5254503 (1993-10-01), Kenney
patent: 5256587 (1993-10-01), Jun et al.
patent: 5302540 (1994-04-01), Ko et al.
patent: 5304828 (1994-04-01), Kim et al.
patent: 5308786 (1994-05-01), Lur et al.
patent: 5313100 (1994-05-01), Ishii et al.
patent: 5332696 (1994-06-01), Kim et al.
patent: 5342800 (1994-08-01), Jun et al.
patent: 5350707 (1994-09-01), Ko et al.
patent: 5358888 (1994-10-01), Ahn et al.
Yoshimaru et al., Rugged surface Poly-Si Electrode and Low temperature deposited Si.sub.3 N.sub.4 for 64MBIT and Beyond STC DRAM cell, pp. 27.4.1-27.4.4 IEDM, 1990.
Wolf et al., Silicon Processing For the VLSI Era, vol. I, Lattice Press 1986, pp. 400-1, 581.
Jun et al., The Fabrication and Electrical Properties of Modulated Stacked Capacitor for Advanced DRAM Applications, IEEE (1992).
IBM Technical Disclosure, Method of Increasing Capacitance Area Using RIE Selectivity, vol. 35, No. 7 (Dec. 1992).
Huang Cheng-Hen
Lur Water
Wu Jiunn-Yuan
Chaudhuri Olik
Tsai H. Jey
United Microelectronics Corp.
LandOfFree
Stacked capacitor process using silicon nodules does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Stacked capacitor process using silicon nodules, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stacked capacitor process using silicon nodules will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1355695