Stacked capacitor having parallel interdigitized structure...

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Field effect device in non-single crystal – or...

Reexamination Certificate

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C257SE33062, C349S038000

Reexamination Certificate

active

07112820

ABSTRACT:
A capacitor structure includes a first conductive layer, a first insulating layer disposed on a substrate in sequence, a second conductive layer disposed on portions of the first insulating layer, a second insulating layer disposed on the second conductive layer and the first insulating layer, a third conductive layer disposed on portions of the second insulating layer, a third insulating layer disposed on the third conductive layer and the second insulating layer, and a fourth conductive layer disposed on the third insulating layer. The third conductive layer and the fourth conductive layer are electrically connected to the first conductive layer and the second conductive layer through at least one first contact hole adjacent to the second conductive layer and at least one second contact hole, respectively.

REFERENCES:
patent: 5182661 (1993-01-01), Ikeda et al.
patent: 6259149 (2001-07-01), Burkhardt et al.
patent: H09-162412 (1997-06-01), None
patent: 2001-265253 (2001-09-01), None

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