Semiconductor device manufacturing: process – Making passive device – Stacked capacitor
Reexamination Certificate
2006-05-23
2006-05-23
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Making passive device
Stacked capacitor
Reexamination Certificate
active
07049205
ABSTRACT:
The present invention discloses a stacked capacitor having interdigital electrodes and method for preparing the same. The stacked capacitor comprises a first interdigital electrode, a second interdigital electrode and a dielectric material sandwiched between the first interdigital electrode and the second interdigital electrode. The first and the second interdigital electrodes comprise a body and a plurality of fingers electrically connected to the body, and the dielectric material can be silicon nitride or silicon oxide. Preferably, fingers of the first interdigital electrode are made of titanium nitride, while fingers of the second interdigital electrode are made of polysilicon. The body of the first and the second interdigital electrodes are preferably made of titanium nitride.
REFERENCES:
patent: 6821837 (2004-11-01), Lian
patent: 2004/0036051 (2004-02-01), Sneh
Coleman W. David
Green Phillip
Oliff & Berridg,e PLC
Promos Technologies Inc.
LandOfFree
Stacked capacitor and method for preparing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Stacked capacitor and method for preparing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stacked capacitor and method for preparing the same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3530825