Semiconductor device manufacturing: process – Making passive device – Trench capacitor
Patent
1998-09-28
2000-10-24
Nelms, David
Semiconductor device manufacturing: process
Making passive device
Trench capacitor
438386, H01L 2120
Patent
active
061366609
ABSTRACT:
A memory cell includes a field effect transistor and a stacked capacitor. The stacked capacitor has one plate formed by a platinum layer over the side walls of a portion of a dielectric layer that overlies a conductive layer that makes contact to a conductive plug connected to the storage node of the cell. The capacitor dielectric overlies the sidewalls and top of the dielectric layer portion and the other plate of the capacitor is formed by a platinum layer over the capacitor dielectric.
REFERENCES:
patent: 5607874 (1997-03-01), Wang et al.
patent: 5672534 (1997-09-01), Huang
patent: 5702989 (1997-12-01), Wang et al.
patent: 5714401 (1998-02-01), Kim et al.
patent: 5716884 (1998-02-01), Hsue et al.
patent: 5721152 (1998-02-01), Jenq et al.
patent: 5750431 (1998-05-01), Wu
patent: 5879957 (1999-03-01), Joo
patent: 5940676 (1999-08-01), Fazan et al.
Gutsche Martin
Kunkel Gerhard
Shen Hua
Le Dung A
Nelms David
Paschburg Donald B.
Siemens Aktiengesellschaft
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