Stackable semiconductor package and method for its fabrication

Details Stackable semiconductor package and method for its fabrication Stackable semiconductor package and method for its fabrication

2006-11-17

2010-06-15

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S786000

Reexamination Certificate

active

07737565

ABSTRACT:
A stackable semiconductor package includes a board having first electrical connections, an integrated circuit chip fixed on a front face of the board, second electrical connections which connect the chip to the first electrical connections of the board and front electrical contact terminals arranged beyond at least one edge of the chip on the front face of this board. An encapsulation block of a coating material is formed on the front face of the board and encapsulates the chip, its electrical connections and the front terminals. The block has at least one opening which at least partially uncovers the front terminals with a view to receiving electrical connection beads of a stacked second package. This one opening is preferably in the form of a groove.

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Preliminary French Search Report, FR 05 11766, dated Aug. 3, 2006.

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