Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2009-07-22
2011-12-13
Brewster, William M. (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S690000, C257S738000
Reexamination Certificate
active
08076765
ABSTRACT:
In one embodiment, a semiconductor device package includes: (1) a substrate unit; (2) connecting elements disposed adjacent to a periphery of the substrate unit and extending upwardly from an upper surface of the substrate unit; (3) a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit; and (4) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit. The package body defines openings that at least partially expose respective ones of the connecting elements. At least one of the connecting elements has a width WC, and at least one of the openings has a width WUadjacent to an upper surface of the package body, such that WU>WC.
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Chang Hui-Shan
Chang Wen-Hsiung
Chen Jen-Chuan
Chen Kuang-Hsiung
Chia Chen-Yu
Advanced Semiconductor Engineering Inc.
Brewster William M.
Cooley LLP
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