Stackable power semiconductor package system

Details Stackable power semiconductor package system Stackable power semiconductor package system

2006-01-27

2009-10-06

Lewis, Monica (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S669000, C257S676000, C257S779000, C257SE23031, C257SE23040, C257SE23047, C257SE23048

Reexamination Certificate

active

07598600

ABSTRACT:
The present invention provides a method of making a stackable power semiconductor package system comprising forming a lower lead frame, having an upward bent source lead and an upward bent gate lead, mounting a power semiconductor device on the lower lead frame utilizing interconnect structures and forming an upper lead frame wherein the upper lead frame is on the power semiconductor device.

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