Stackable optoelectronics chip-to-chip interconnects and...

Details Stackable optoelectronics chip-to-chip interconnects and... Stackable optoelectronics chip-to-chip interconnects and...

2007-09-18

2007-09-18

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S082000, C257S084000, C257S088000, C257S098000, C257S686000, C257SE25032

Reexamination Certificate

active

10906615

ABSTRACT:
An optoelectronics chip-to-chip interconnects system is provided, including packaged chips to be connected on printed-circuit-board (PCB), multiple-packaged chip, optical-electrical(O-E) conversion means, waveguide-board, and PCB. Single to multiple chips interconnects can be possible using this technique. The packaged-chip includes semiconductor-die and its package based on the ball-grid array or chip-scale-package. The O-E board includes the optoelectronics components and multiple electrical contacts. The waveguide board includes electrical conductors transferring signal from O-E board to PCB and the flex optical waveguide easily stackable onto the PCB, to guide optical signal from one chip-to-other chip. The chip-to-chip interconnects system is pin-free and compatible with the PCB. The main advantages are that standard packaged-chip and conventional PCB technology can be used for low speed electrical signal connection. Also, the part of the heat from the packaged chip can be transmitted to PCB through conductors, so that complex cooling system can be avoided.

REFERENCES:
patent: 5198684 (1993-03-01), Sudo
patent: 5612549 (1997-03-01), Nelson et al.
patent: 6052498 (2000-04-01), Paniccia
patent: 6434308 (2002-08-01), Trezza

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