Stackable modules and multimodular assemblies

Details Stackable modules and multimodular assemblies Stackable modules and multimodular assemblies

1995-01-23

1997-12-23

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257685, 257686, 257777, 257723, 361744, 361761, 361764, 361733, 361803, 361790, 439 66, 439 91, H01L 23055, H01L 23053, H05K 702, H01R 909

Patent

active

057012334

ABSTRACT:
Stacked, multimodular circuit assemblies are provided which comprise stacked, resealable, modules containing electronic circuitry, each module having a plurality of electrically conductive, embedded through-vias between the upper and major surfaces thereof. The through-vias are contained within the module matrix outside of the circuit-containing cavity or "tub" of the module and within the outer edges of the module body. Electronic circuitry contained in the module cavity is electrically connected to the through-vias by signal traces or vias passing out of the cavity and into contact with the through-vias, and adjacent modules are electrically interconnected by a resealable, multichannel connector array between adjacent modules having electrically conductive channels coupling opposing through-vias of the adjacent modules. The connector arrays can also serve to seal the assembly when the entire assemblage of modules is compressed and to connect the stacked modular assembly to exterior circuitry such as a printed circuit board or other device. Methods are also provided for assembling and electrically interconnecting electronic components within such stacked multimodular assemblies by attaching components of an electronic circuit to at least two stackable modules of the type described within the cavity thereof, interconnecting the circuit components with the described through-vias, and stacking and interconnecting the stackable modules with the described multichannel connector arrays interposed between each adjacent module pair.

REFERENCES:
patent: 4574331 (1986-03-01), Smolley
patent: 4581675 (1986-04-01), Smolley
patent: 4764846 (1988-08-01), Go
patent: 5007841 (1991-04-01), Smolley
patent: 5027191 (1991-06-01), Bourdelaise et al.
patent: 5043794 (1991-08-01), Tai et al.
patent: 5241456 (1993-08-01), Marcinkiewicz et al.
patent: 5376825 (1994-12-01), Tukamoto et al.
patent: 5432681 (1995-07-01), Linderman
IBM Technical Disclosure Bulletin "Stacked High-Density Multichip Module" by Jarvela et al. vol. 14 No. 10, Mar. 1972.
Palmer & Newton, 3-D Packaging using Low-Temperature Cofired Ceramic The International Journal of Microcircuits & Electronic Packaging vol. 16, No. 4, Fourth Quarter 1993, pp. 279-284.

Affiliated with

Also associated with

Rating

Stackable modules and multimodular assemblies does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stackable modules and multimodular assemblies, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stackable modules and multimodular assemblies will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1805660