Stackable double-density integrated circuit assemblies

Details Stackable double-density integrated circuit assemblies Stackable double-density integrated circuit assemblies

1995-11-29

1998-05-19

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257686, 257777, 257797, 361735, 361772, 361783, 361820, 439 69, H01R 909, H01L 2302

Patent

active

057544085

ABSTRACT:
Integrated circuit (IC) packages having leads projecting in the vertical direction are provided with male and female locking elements of snap fasteners that allow a pair of IC packages to be stacked into a module so as to align the leads of one package with the leads of another package. The leads of the packages are soldered to a PCB that carries the external conductors to be connected with the inner circuits of the packages. The male locking element on one of the IC packages is tightly engaged with the female locking element on another IC package to prevent the soldered leads of one package from touching the leads of another package. Multiple modules are positioned on the PCB to double the packaging density of the PCB.

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IBM Technical Disclosure Bulletin "Stackable Plastic Semiconductor Chip Carrier" by Robock vol. 27 No. 4B pp. 2389 and 2390, Sep. 1984.

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