Stackable ball grid array module and method

Details Stackable ball grid array module and method Stackable ball grid array module and method

1999-02-01

2000-10-10

Gaffin, Jeffrey

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361761, 361764, 361784, 257686, 257778, 395494, H05K 118

Patent

active

061308234

ABSTRACT:
A stackable ball grid array module in which a chip select decoder is used to reduce the number of busses required for communication between modules. Additional modules may be added without requiring additional interconnect lines in the array. Cooling of the individual modules may be accomplished using a support member made from an enhanced heat transfer material or placing an enhanced heat transfer material layer between the modules. The devices on the module may be encapsulated, and the modules may be constructed in a chip first or cavity-down configuration. Methods are also disclosed.

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patent: 5977640 (1999-11-01), Bertin et al.
patent: 5994166 (1999-11-01), Akram et al.

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