Stack up assembly

Details Stack up assembly Stack up assembly

2005-11-29

2005-11-29

Vortman, Anatoly (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S720000, C361S718000, C361S710000, C257S707000, C257S712000, C257S713000

Reexamination Certificate

active

06970358

ABSTRACT:
A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector. Also optionally, heat-generating devices may be mechanically and electrically coupled with the second printed circuit board through interposers configured (upon assembly) to raise the heat-generating devices through the openings in the first printed circuit board to contact a heat sink.

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