Stack up assembly

Details Stack up assembly Stack up assembly

2005-03-01

2005-03-01

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S719000, C361S790000, C257S707000, C257S712000

Reexamination Certificate

active

06862186

ABSTRACT:
A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Heat-generating devices are thermally coupled with a thermal pad on one or more of the printed circuit boards. The thermal pad is then thermally coupled with the heat sink. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector.

REFERENCES:
patent: 5761044 (1998-06-01), Nakajima
patent: 6426877 (2002-07-01), Baba
patent: 6700783 (2004-03-01), Liu et al.
patent: 6760224 (2004-07-01), Moden et al.

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