Stack-type semiconductor package having one or more...

Details Stack-type semiconductor package having one or more... Stack-type semiconductor package having one or more...

2006-02-28

2006-02-28

Cuneo, Kamand (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S803000, C257S686000

Reexamination Certificate

active

07006360

ABSTRACT:
One or more semiconductor devices are packaged inside a stack-type semiconductor package. The stack-type semiconductor package has a printed circuit board having a circuit pattern. A first semiconductor memory device (first device) is stacked on the PCB and is electrically connected to the PCB circuit pattern. A conductive frame has first terminals and second terminals, and the first terminals are electrically connected to the PCB circuit pattern. A second semiconductor memory device (second device) is stacked on the conductive frame over the first device and is electrically connected to second terminals of the conductive frame. The second device is electrically connected to the PCB circuit pattern and the first device via the conductive frame. Each of the first device may be either a ball grid array type stack package (BGA package) or a thin-small-outline-package-type package. The second device may be a BGA package.

REFERENCES:
patent: 4437235 (1984-03-01), McIver
patent: 5290971 (1994-03-01), Hamaguchi et al.
patent: 5438224 (1995-08-01), Papageorge et al.
patent: 5977626 (1999-11-01), Wang et al.
patent: 6014316 (2000-01-01), Eide
patent: 6084780 (2000-07-01), Happoya
patent: 6487078 (2002-11-01), Kledzik et al.
patent: 6528353 (2003-03-01), Suh et al.

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