Stack structure cutting method and stack structure

Details Stack structure cutting method and stack structure Stack structure cutting method and stack structure

2005-02-10

2010-11-23

Heinrich, Samuel M (Department: 3742)

Electric heating

Metal heating

By arc

C219S121840, C438S463000

Reexamination Certificate

active

07838796

ABSTRACT:
A method of cutting a stack structure and the stack structure are disclosed. In the stack structure comprising at least one laser absorbing member and at least one laser transmitting member, a plurality of grooves are formed on the surface of the laser transmitting member which is in contact with the laser absorbing member, which grooves correspond to a plurality off cutting lines. In order to cut this stack structure, a laser beam is emitted on the laser absorbing member along each of the cutting lines, while at the same time gas is injected at the laser irradiated spot.

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“Japanese Office Action”, Partial translation. Mailed by the Japanese Patent Office on Nov. 10, 2009, in connection with JP 2004-344330.

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