Stack package for high density integrated circuits

Details Stack package for high density integrated circuits Stack package for high density integrated circuits

2007-05-15

2007-05-15

Ho, Tu-Tu (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S700000, C257S723000, C257S693000, C257SE25027

Reexamination Certificate

active

11002480

ABSTRACT:
A stack package for a high density memory module includes at least one memory chip, an ASIC and an interposer, wherein the interposer comprises a first surface having contacts arranged in electrical communication with corresponding contacts on the ASIC and a second, substantially opposite surface including contacts arranged in electrical communication with corresponding contacts on a PCB. The at least one memory chip is dimensioned to fit within a cutout section in the interposer.

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patent: 2005/0104196 (2005-05-01), Kashiwazaki
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