Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2005-08-02
2005-08-02
Potter, Roy (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S723000
Reexamination Certificate
active
06924556
ABSTRACT:
Disclosed are a stack package and a method of manufacturing the same, which has improved electrical properties by virtue of a reduced signal line length, and also allows reduction of production costs of the stack package. The stack package of the present invention includes panels having an area for mounting respective CSP packages and pin-shaped connectors. The panels include circuit patterns for electrical connection to the CSP packages, which are formed at portions of the panels corresponding to the CSP packages to be mounted. Also, the panels have first openings for electrical connection to the circuit patterns, which are formed at both sides of the circuit patterns. The pin-shaped connectors are inserted through the first openings of the panels. The panels are stacked in at least two layers in such a manner that the first openings of one panel correspond to the first openings of the other panels, so that the connectors are electrically connected to the circuit patterns of the stacked panels.
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patent: 6566746 (2003-05-01), Isaak et al.
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patent: 2004/0046005 (2004-03-01), Cha
Dickinson Wright PLLC
Edwards, Esq. Jean C.
Potter Roy
Unisemicon Co., Ltd.
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