Stack package and fabricating method thereof

Details Stack package and fabricating method thereof Stack package and fabricating method thereof

2007-11-06

2007-11-06

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000, C257S702000, C257SE23169

Reexamination Certificate

active

10745566

ABSTRACT:
Disclosed are a stack package and a fabricating method thereof using a ball grid array semiconductor package (hereinafter, referred to as “BGA PKG”). The stack package can easily electrically connect the stacked BGA PKGs with each other by simplifying a stack structure between the BGA PKGs, and increase bonding reliability by improving bonding force bonded portions of solder balls of substrates.

REFERENCES:
patent: 5776797 (1998-07-01), Nicewarner et al.
patent: 6683377 (2004-01-01), Shim et al.
patent: 2003/0168725 (2003-09-01), Warner et al.

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