Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2006-08-18
2009-06-09
Chambliss, Alonzo (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S686000, C257S701000, C257S724000, C257S782000, C257SE25013, C257SE21614, C361S777000, C361S784000, C438S107000, C438S109000
Reexamination Certificate
active
07545029
ABSTRACT:
A stacked microelectronic assembly includes a base substrate having conductive elements projecting from a bottom surface thereof and a first microelectronic subassembly underlying a bottom surface of the base substrate. The first microelectronic subassembly includes a first dielectric substrate, a first microelectronic element connected with the first dielectric substrate and first conductive posts projecting from the first dielectric substrate toward the bottom surface of the base substrate for electrically interconnecting the first microelectronic element and the base substrate. The assembly also has a second microelectronic subassembly overlying the base substrate. The second microelectronic subassembly includes a second dielectric substrate, a second microelectronic element connected with the second dielectric substrate and second conductive posts projecting toward the top surface of the base substrate for electrically interconnecting the second microelectronic element and the base substrate. The first microelectronic subassembly has a first height and the conductive elements projecting from the bottom surface of the base substrate have a second height that is greater than the first height of the first microelectronic subassembly.
REFERENCES:
patent: 3390308 (1968-06-01), Marley
patent: 3923359 (1975-12-01), Newsam
patent: 4371744 (1983-02-01), Badet et al.
patent: 4371912 (1983-02-01), Guzik
patent: 4489364 (1984-12-01), Chance
patent: 4540226 (1985-09-01), Thompson et al.
patent: 4551746 (1985-11-01), Gilbert et al.
patent: 4558397 (1985-12-01), Olsson
patent: 4638348 (1987-01-01), Brown et al.
patent: 4734825 (1988-03-01), Peterson
patent: 4754316 (1988-06-01), Reid
patent: 4761681 (1988-08-01), Reid
patent: 4804132 (1989-02-01), DiFrancesco
patent: 4841355 (1989-06-01), Parks
patent: 4868712 (1989-09-01), Woodman
patent: 4897918 (1990-02-01), Osaka et al.
patent: 4941033 (1990-07-01), Kishida
patent: 4956694 (1990-09-01), Eide
patent: 4975079 (1990-12-01), Beaman et al.
patent: 4982265 (1991-01-01), Watanabe et al.
patent: 4994902 (1991-02-01), Okahashi et al.
patent: 4996583 (1991-02-01), Hatada
patent: 4996587 (1991-02-01), Hinrichsmeyer et al.
patent: 5028986 (1991-07-01), Sugano et al.
patent: 5045921 (1991-09-01), Lin et al.
patent: 5083697 (1992-01-01), Difrancesco
patent: 5117282 (1992-05-01), Salatino
patent: 5128831 (1992-07-01), Fox, III et al.
patent: 5138438 (1992-08-01), Masayuki et al.
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5148266 (1992-09-01), Khandros et al.
patent: 5172303 (1992-12-01), Bernardoni et al.
patent: 5189505 (1993-02-01), Bartelink
patent: 5196726 (1993-03-01), Nishiguchi et al.
patent: 5198888 (1993-03-01), Sugano et al.
patent: 5214308 (1993-05-01), Nishiguchi et al.
patent: 5222014 (1993-06-01), Lin
patent: 5247423 (1993-09-01), Lin et al.
patent: 5281852 (1994-01-01), Normington
patent: 5311401 (1994-05-01), Gates, Jr. et al.
patent: 5313096 (1994-05-01), Eide
patent: 5334875 (1994-08-01), Sugano et al.
patent: 5347159 (1994-09-01), Khandros et al.
patent: 5376825 (1994-12-01), Tukamoto et al.
patent: 5384689 (1995-01-01), Shen
patent: 5397916 (1995-03-01), Normington
patent: 5397997 (1995-03-01), Tuckerman et al.
patent: 5412247 (1995-05-01), Martin
patent: 5414298 (1995-05-01), Grube et al.
patent: 5455390 (1995-10-01), DiStefano et al.
patent: 5455740 (1995-10-01), Burns
patent: 5479318 (1995-12-01), Burns
patent: 5489749 (1996-02-01), DiStefano et al.
patent: 5518964 (1996-05-01), DiStefano et al.
patent: 5543664 (1996-08-01), Burns
patent: 5548091 (1996-08-01), DiStefano et al.
patent: 5552631 (1996-09-01), McCormick
patent: 5552963 (1996-09-01), Burns
patent: 5600541 (1997-02-01), Bone et al.
patent: 5608265 (1997-03-01), Kitano et al.
patent: 5616958 (1997-04-01), Laine et al.
patent: 5625221 (1997-04-01), Kim et al.
patent: 5637536 (1997-06-01), Val et al.
patent: 5639695 (1997-06-01), Jones et al.
patent: 5642261 (1997-06-01), Bond et al.
patent: 5656856 (1997-08-01), Kweon
patent: 5659952 (1997-08-01), Kovac et al.
patent: 5668405 (1997-09-01), Yamashita
patent: 5677566 (1997-10-01), King et al.
patent: 5679977 (1997-10-01), Khandros et al.
patent: 5681777 (1997-10-01), Lynch et al.
patent: 5701031 (1997-12-01), Oguchi et al.
patent: 5731709 (1998-03-01), Pastore et al.
patent: 5734555 (1998-03-01), McMahon
patent: 5751063 (1998-05-01), Baba
patent: 5783870 (1998-07-01), Mostafazadeh et al.
patent: 5784264 (1998-07-01), Tanioka
patent: 5801072 (1998-09-01), Barber
patent: 5801439 (1998-09-01), Fujisawa et al.
patent: 5802699 (1998-09-01), Fjelstad et al.
patent: 5804874 (1998-09-01), An et al.
patent: 5834339 (1998-11-01), Distefano et al.
patent: 5835988 (1998-11-01), Ishii et al.
patent: 5844315 (1998-12-01), Melton et al.
patent: 5861666 (1999-01-01), Bellaar
patent: 5883426 (1999-03-01), Tokuno et al.
patent: 6030856 (2000-02-01), DiStefano et al.
patent: 6054756 (2000-04-01), DiStefano et al.
patent: 6072233 (2000-06-01), Corisis et al.
patent: 6093029 (2000-07-01), Kwon et al.
patent: 6121676 (2000-09-01), Solberg
patent: 6177636 (2001-01-01), Fjelstad
patent: 6180881 (2001-01-01), Isaak
patent: 6195268 (2001-02-01), Eide
patent: 6202297 (2001-03-01), Faraci et al.
patent: 6218848 (2001-04-01), Hembree et al.
patent: 6225688 (2001-05-01), Kim et al.
patent: 6232152 (2001-05-01), DiStefano et al.
patent: 6258625 (2001-07-01), Brofman et al.
patent: 6268649 (2001-07-01), Corisis et al.
patent: 6291259 (2001-09-01), Chun
patent: 6303997 (2001-10-01), Lee et al.
patent: 6310386 (2001-10-01), Shenoy
patent: 6313522 (2001-11-01), Akram et al.
patent: 6335565 (2002-01-01), Miyamoto et al.
patent: 6342728 (2002-01-01), Miyazaki et al.
patent: 6365975 (2002-04-01), DiStefano et al.
patent: 6369445 (2002-04-01), Khoury
patent: 6388264 (2002-05-01), Pace
patent: 6417688 (2002-07-01), Dabral et al.
patent: 6458411 (2002-10-01), Goossen et al.
patent: 6462421 (2002-10-01), Hsu et al.
patent: 6465878 (2002-10-01), Fjelstad et al.
patent: 6495914 (2002-12-01), Sekine et al.
patent: 6496026 (2002-12-01), Long et al.
patent: 6515870 (2003-02-01), Skinner et al.
patent: 6521984 (2003-02-01), Matsuura
patent: 6550666 (2003-04-01), Chew et al.
patent: 6578754 (2003-06-01), Tung
patent: 6624653 (2003-09-01), Cram
patent: 6699730 (2004-03-01), Kim et al.
patent: 6770980 (2004-08-01), Shibata
patent: 6774317 (2004-08-01), Fjelstad
patent: 6826827 (2004-12-01), Fjelstad
patent: 6838768 (2005-01-01), Corisis et al.
patent: 6885106 (2005-04-01), Damberg et al.
patent: 7061122 (2006-06-01), Kim et al.
patent: 7098070 (2006-08-01), Chen et al.
patent: 7138299 (2006-11-01), Fjelstad
patent: 7294928 (2007-11-01), Bang et al.
patent: 7317249 (2008-01-01), Crisp et al.
patent: 2004/0222518 (2004-11-01), Haba et al.
patent: 2005/0116326 (2005-06-01), Haba et al.
patent: 2005/0168231 (2005-08-01), Kim
patent: 2005/0173805 (2005-08-01), Damberg et al.
patent: 2005/0181544 (2005-08-01), Haba et al.
patent: 2005/0181655 (2005-08-01), Haba et al.
patent: 2005/0263868 (2005-12-01), Aoyagi
patent: 2005/0284658 (2005-12-01), Kubota et al.
patent: 2005/0285246 (2005-12-01), Haba et al.
patent: 2006/0027899 (2006-02-01), Humpston et al.
patent: 2006/0138647 (2006-06-01), Crisp et al.
patent: 2006/0208348 (2006-09-01), Ohsaka et al.
patent: 2006/0249857 (2006-11-01), Haba et al.
patent: 2007/0182018 (2007-08-01), Pendse
patent: 52-075981 (1977-06-01), None
patent: 56-61151 (1981-05-01), None
patent: 57-31166 (1982-02-01), None
patent: 58-178529 (1983-10-01), None
patent: 60-194548 (1984-03-01), None
patent: 61-029140 (1986-02-01), None
patent: 61-101067 (1986-05-01), None
patent: 61-120454 (1986-06-01), None
patent: 61-137335 (1986-06-01), None
patent: 61-255046 (1986-11-01), None
patent: 63-18654 (1988-01-01), None
patent: 62-226307 (1989-03-01), None
patent: 62-68015 (1994-09-01), None
patent: WO-03/019654 (2003-03-01), None
North Corporation, “Processed Intra-layer Interconnection Material for PWBs [Etched Copper Bump with Copper Foil],” NMBI™, Version 2001.6.
Neo-Manhattan Technology, A Novel HDI Manufacturing Process, &#x
Crisp Richard Dewitt
Green Ronald
Humpston Giles
Wilson Stuart E.
Chambliss Alonzo
Lerner David Littenberg Krumholz & Mentlik LLP
Tessera Inc.
LandOfFree
Stack microelectronic assemblies does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Stack microelectronic assemblies, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stack microelectronic assemblies will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4128867