Stack MCP and manufacturing method thereof

Details Stack MCP and manufacturing method thereof Stack MCP and manufacturing method thereof

2008-12-31

2010-11-16

Estrada, Michelle (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S455000, C257SE23021, C257SE27137, C257SE27144, C257SE27161

Reexamination Certificate

active

07833836

ABSTRACT:
A semiconductor chip having an adhesive layer previously formed on an element forming surface thereof and having a bump exposed from the surface of the adhesive layer is wire-bonded to a printed circuit board. Another semiconductor chip is stacked on the above semiconductor chip with the adhesive layer disposed therebetween and is wire-bonded to the printed circuit board by wire bonding. Likewise, at least one semiconductor chip is sequentially stacked on the thus attained semiconductor structure to form a stack MCP.

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