Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2007-10-23
2007-10-23
Estrada, Michelle (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S738000, C257SE23021, C257SE27137, C257SE27144, C257SE27161, C438S118000
Reexamination Certificate
active
10891513
ABSTRACT:
A semiconductor chip having an adhesive layer previously formed on an element forming surface thereof and having a bump exposed from the surface of the adhesive layer is wire-bonded to a printed circuit board. Another semiconductor chip is stacked on the above semiconductor chip with the adhesive layer disposed therebetween and is wire-bonded to the printed circuit board by wire bonding. Likewise, at least one semiconductor chip is sequentially stacked on the thus attained semiconductor structure to form a stack MCP.
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Iizuka Kazuhiro
Kiritani Mika
Takyu Shinya
Estrada Michelle
Finnegan Henderson Farabow Garrett & Dunner L.L.P.
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