Stack land grid array package and method for manufacturing...

Details Stack land grid array package and method for manufacturing... Stack land grid array package and method for manufacturing...

2005-08-26

2008-08-05

Zarneke, David (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S779000

Reexamination Certificate

active

07408254

ABSTRACT:
A semiconductor device has a substrate having first, second, and third surfaces. An electrically conductive pattern is formed on the first surface. A semiconductor die has a bond pad formed on a first surface thereof. A second surface of the semiconductor die is coupled to the first surface of the substrate. A first connection member electrically couples the bond pad and the electrically conductive pattern. A first land has a first, second, and third surfaces. The second surface of the first land is coupled to the first electrically conductive pattern. A first encapsulant encapsulates the first semiconductor die, the first connection member, and the first land such that the first surface of the first land is exposed.

REFERENCES:
patent: 5239198 (1993-08-01), Lin et al.
patent: 5838070 (1998-11-01), Naruse et al.
patent: 6906414 (2005-06-01), Zhao et al.
patent: 2002/0086459 (2002-07-01), Nakajima
patent: 2004/0113275 (2004-06-01), Karnezos

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