Stack arrangement for two semiconductor memory chips and printed

Details Stack arrangement for two semiconductor memory chips and printed Stack arrangement for two semiconductor memory chips and printed

1998-12-21

2000-12-05

Gaffin, Jeffrey

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361750, 361751, 361760, 361807, 174254, 174255, 174260, 257723, 257686, H05K 114

Patent

active

061575410

ABSTRACT:
Two semiconductor memory chips are placed onto a flexible wiring and are shaped by simple folding of the flexible wiring about a central elastic line, into a space-efficient stack arrangement whose outer contacts are formed only at one marginal side. To form memory cards, a plurality of such stack arrangements can be placed onto a simply constructed printed board.

REFERENCES:
patent: 5224023 (1993-06-01), Smith et al.
patent: 5448511 (1995-09-01), Paurus et al.
patent: 5708297 (1998-01-01), Clayton
patent: 5789815 (1998-08-01), Tessier et al.
patent: 5949657 (1999-09-01), Karabatos
patent: 6021048 (2000-02-01), Smith

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