Stack arrangement for two semiconductor memory chips and printed

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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361750, 361751, 361760, 361807, 174254, 174255, 174260, 257723, 257686, H05K 114

Patent

active

061575410

ABSTRACT:
Two semiconductor memory chips are placed onto a flexible wiring and are shaped by simple folding of the flexible wiring about a central elastic line, into a space-efficient stack arrangement whose outer contacts are formed only at one marginal side. To form memory cards, a plurality of such stack arrangements can be placed onto a simply constructed printed board.

REFERENCES:
patent: 5224023 (1993-06-01), Smith et al.
patent: 5448511 (1995-09-01), Paurus et al.
patent: 5708297 (1998-01-01), Clayton
patent: 5789815 (1998-08-01), Tessier et al.
patent: 5949657 (1999-09-01), Karabatos
patent: 6021048 (2000-02-01), Smith

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