Stable waterborne epoxy resin dispersion containing micronized d

Details Stable waterborne epoxy resin dispersion containing micronized d Stable waterborne epoxy resin dispersion containing micronized d

1995-06-07

1996-03-19

Krass, Frederick

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

427386, C08L 6302

Patent

active

055004628

ABSTRACT:
A process for producing stable dispersions of epoxy resins is presented in which an epoxy resin is mixed with water in the presence of a reactive surfactant to form a predispersed resin. To this predispersed resin, a micronized dicyandiamide based curing agent is added to form a predispersed resinous mass. The mass is stirred for a time and at a temperature sufficient to convert the predispersed resinous mass to a stable epoxy resin dispersion where the water is the continuous phase and the resin is the dispersed phase. The dispersion is useful as a one-pack epoxy resin system in applications such as binders for non-wovens, papers, textiles, composites, and laminates and in many coating applications.

REFERENCES:
patent: 4122067 (1978-10-01), Anderson
patent: 4222918 (1980-12-01), Zentner et al.
patent: 4385138 (1983-05-01), Sagane et al.
patent: 4421877 (1983-12-01), Alvino
patent: 4588617 (1986-05-01), Oka
patent: 5236974 (1993-08-01), Dreischhoff et al.

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