Stable high solids, high thermal conductivity pastes

Compositions – Electrically conductive or emissive compositions – Elemental carbon containing

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252514, 252518, 252521, 252516, 252510, 252512, 252502, 252509, 252503, 252504, 252506, 106266, 524401, 524439, 524404, 524408, 524441, 524430, 524432, 524433, 523514, H01B 106, C08L 9100

Patent

active

050986090

ABSTRACT:
A paste including a thermally conducting solid filler, a nonaqueous liquid carrier and a stabilizing dispersant. The pastes are highly concentrated, of low viscosity, electrically resistive, highly thermally conducting and stable. The pastes are easily applicable to electrical and electronic devices and may be removed therefrom with common solvents to access components where necessary.

REFERENCES:
patent: 3778287 (1973-12-01), Stansfield et al.
patent: 3885984 (1975-05-01), Wright
patent: 4265775 (1981-05-01), Aakalu et al.

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