Stabilizing process for porous silicon and resulting light emitt

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal

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438505, 438960, 438962, 257 79, 257103, H01L 2120, H01L 3300

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06017773&

ABSTRACT:
A method of producing light-emitting porous silicon light-emitting diode including forming a porous silicon p+ layer in a p-type silicon wafer, annealing the wafer at 800-950.degree. C. in an atmosphere of inert gas and 1-25% oxygen, depositing a polycrystalline silicon film on the porous silicon layer, and n+ doping a portion of the polycrystalline silicon film.

REFERENCES:
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"Effects of Surface Treatment on Light Emission from Porous Silicon", Khan et al., Mat. Res. Soc. Symp. Proc. vol. 256, pp. 143-146.
"Thermal Nitridation of p-type Porous Silicon in Ammonia", Morazzani et al., Thin Solid Films 276 (1996), pp. 32-35.
"Visible Photoluminescence From Low Temperature Deposited Hydrogenated Amorphous Silicon Nitride", Aydinli et al., Solid State Communications, vol. 98, No. 4, pp. 273-277.
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"Thermal Treatment Investigations of the Photovoltage of Porous Silicon", Wang et al., 27th International SAMPE Technical Conference, pp. 534-538.

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