Stabilizing mixture for a chemical copper plating bath

Details Stabilizing mixture for a chemical copper plating bath Stabilizing mixture for a chemical copper plating bath

1983-02-15

1984-04-17

Hayes, Lorenzo B.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 126, 427305, C23C 302

Patent

active

044432577

ABSTRACT:
An aqueous solution for electroless autocatalytic copper plating, containing a source of cupric ions, a source of hydroxylic ions, a reducing agent and a complexing agent in such a quantity as to render soluble the cupric ions in an alkaline medium, which further contains a stabilizing mixture formed by allylthiourea, at least a ferrocyanide of alkali metal or of ammonium ion, and at least an octylphenylether of ethylene polyoxide with 9-10 moles of ethylene oxide for each mole of octylphenol, the said three stabilizing compounds exerting a synergical action.
This solution shows a very good stability and produces copper deposits having clear and brilliant appearance and good ductility properties.

REFERENCES:
patent: 3361580 (1968-01-01), Schneble et al.
patent: 3485643 (1969-12-01), Zeblisky et al.
patent: 3804638 (1974-04-01), Jonker et al.

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