Stabilized spray displacement plating process

Details Stabilized spray displacement plating process Stabilized spray displacement plating process

1991-11-27

1993-06-08

Lusigan, Michael

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427427, 427433, 427345, C23C 2600

Patent

active

052177513

ABSTRACT:
An efficient spray displacement tin plating process of copper printed circuit innerlayers is disclosed for the manufacture of multilayer printed circuit boards. The displacement tin plating solution is stabilized and replenished by incorporating free tin metal in the plating solution reservoir. Unwanted tin(IV) ions which are produced by aerial oxidation during the spray process, are reacted with tin metal in the reservoir to produce sufficient tin(II) ions to compensate for losses due to plating, oxidation and the like. Not only is the plating bath stabilized, but its useful life is extended dramatically.

REFERENCES:
patent: 2891871 (1959-06-01), Ceresa
patent: 3303029 (1967-02-01), Shipley
patent: 4027055 (1977-05-01), Schneble
patent: 4234631 (1980-11-01), Davis
patent: 4657632 (1987-04-01), Holtzman
patent: 4715894 (1987-12-01), Holtzman
patent: 4790912 (1988-12-01), Holtzmann
patent: 4882202 (1989-11-01), Holtzman
patent: 5073456 (1991-12-01), Palladino

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