Radiant energy – Photocells; circuits and apparatus – Optical or pre-photocell system
Patent
1995-03-23
1997-03-11
Le, Que T.
Radiant energy
Photocells; circuits and apparatus
Optical or pre-photocell system
25037008, 257186, H01J 314
Patent
active
056103891
ABSTRACT:
A hybrid focal plane array (FPA) structure including a soft, localized, and thick epoxy for supporting the FPA on a cooling device. The hybrid FPA arrangement includes a crystalline optical substrate with a layer of an optically sensitive material disposed on one surface of the substrate. The optically sensitive side of the substrate layer is coupled to a MUX chip via an interconnection scheme. The layered configuration of the detector, the optically-sensitive material, interconnection network, and the MUX is mounted to a platform or dewar cold plate with a pliable, thick epoxy which is locally deposited onto the platform to effectively form a raised mounting cushion which supports the MUX and reduces deleterious effects resulting form a close coupling of the FPA to the mounting platform.
REFERENCES:
patent: 4943491 (1990-07-01), Norton et al.
patent: 5308980 (1994-05-01), Barton
patent: 5365088 (1994-11-01), Myrosznyk
patent: 5382797 (1995-01-01), Kunimoto et al.
K. Zouari and Y. C. Lee, "Stress Analysis of the Vertical Interconnect for Three-Dimensional Packaging", Journal Of Electrical Packaging, Sep. 1991, vol. 113, pp. 233-239.
Tsung-Yu Pan and Yi-Hsin, Pao, "Stress Analysis of Multilayer Stacked Asemblies", Presented At The Winter Annual Meeting San Francisco, California-Dec. 10-15, 1989, pp. 1-5.
Yi-Hsin Pao and Ellen Eisele, "Interfacial Shear and Peel Stresses in Multilayered Thin Stacks Subjected to Uniform Thermal Loading", Transactions Of The ASME, Jun. 1991, pp. 164-172.
An-Yu Kuo and Kuan-Luen Chen, "Effects of Thickness on Thermal Stresses in a Thin Solder or Adhesive Layer", Presented At The Winter Annual Meeting Dec. 1-6, 1991 Atlanta, GA, pp. 1-6.
E. Subir, "Technical Briefs", Predicted Residual Bow of Thin Plastic Packages of Integrated Circuit Devices, Journal Of Electronic Packaging, Dec. 1992, pp. 467-470.
V. I. Lavrenyuk and V. A. Nakura, "Thermal Stresses In A Multilayer Semiconductor Structure", Jan. 1984, Flemm Publishing Corporation, pp. 2-8 .
Arthur David J.
Le Que T.
Montanye George A.
Oh Susie H.
Rockwell International Corporation
LandOfFree
Stabilized hybrid focal plane array structure does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Stabilized hybrid focal plane array structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stabilized hybrid focal plane array structure will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-445131