Stabilized electroless plating solutions

Details Stabilized electroless plating solutions Stabilized electroless plating solutions

1977-09-13

1978-11-07

Hayes, Lorenzo B.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 126, 427430A, 427437, C23C 302

Patent

active

041243994

ABSTRACT:
An electroless copper plating solution is characterized by the addition of a small but effective amount of a source of gallium ions for improved stability alone or in combination with a secondary stabilizer.

REFERENCES:
patent: 3615737 (1971-10-01), Schneble et al.
patent: 3650777 (1972-03-01), Schneble et al.

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