Plastic and nonmetallic article shaping or treating: processes – With severing – removing material from preform mechanically,... – Making hole or aperture in article
Patent
1974-09-16
1976-10-26
Thurlow, Jeffery R.
Plastic and nonmetallic article shaping or treating: processes
With severing, removing material from preform mechanically,...
Making hole or aperture in article
29625, 156 3, 156253, 264235, 264104, 264343, 264346, H05K 300, B32B 3116
Patent
active
039884082
ABSTRACT:
A process for stabilizing printed circuit board substrate or laminate through application of a number of laminate conditioning and baking cycles which function to provide the laminates with dimensional stability. This enables greater control and more precise drilling of the laminates in subsequent fabrication and assembly operations. The dimensional stability for a substrate becomes more critical as the substrate size is increased.
REFERENCES:
patent: 3210214 (1965-10-01), Smith
patent: 3352960 (1967-11-01), McLaughlin
patent: 3409988 (1968-11-01), Zelnick
patent: 3452133 (1969-06-01), Bratton et al.
patent: 3466360 (1969-09-01), Chipman
patent: 3508330 (1970-04-01), Kubik
patent: 3799802 (1974-03-01), Schneble, Jr. et al.
Haining Frank W.
Rubino Robert V.
Wiley Robert T.
International Business Machines - Corporation
Krenzer Cyril A.
Thurlow Jeffery R.
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