Stability enhancement of molten solder droplets as ejected from

Details Stability enhancement of molten solder droplets as ejected from Stability enhancement of molten solder droplets as ejected from

1996-09-30

1999-01-19

Kastler, Scott

Dispensing

Molten metal dispensing

With heating or cooling

222590, B22D 3506

Patent

active

058605754

ABSTRACT:
The size and shape of molten solder droplets ejected from a nozzle of a droplet pump are stabilized using flux transported into the aperture region of the nozzle through which the droplets are ejected. The flux is periodically replenished as necessary to remove solder oxides and dross, as well as to lubricate the aperture. The flux may be deposited by spraying onto the nozzle, submersion of the nozzle, contact of the nozzle to a flux film, contact of the nozzle with an intermediate transfer medium, or through injection internal to the nozzle assembly. Fluxes exhibiting high activity and high thermal stability at elevated temperatures are preferred.

REFERENCES:
patent: 4754900 (1988-07-01), MacKay
patent: 4898422 (1990-02-01), Muller
patent: 4972900 (1990-11-01), Szczypiorski
patent: 5042708 (1991-08-01), Ledermann et al.
patent: 5229016 (1993-07-01), Hayes et al.
patent: 5377961 (1995-01-01), Smith et al.
patent: 5415679 (1995-05-01), Wallace
patent: 5446261 (1995-08-01), Hernandez et al.

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