Sputtering unit

Details Sputtering unit Sputtering unit

1992-03-24

1994-03-08

Nguyen, Nam X.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429806, 20429807, 20429823, 20429826, C23C 1434

Patent

active

052924190

ABSTRACT:
The invention relates to a sputtering unit with an electrode (3) and a target (2) connected with this electrode (3) wherein this target (2) is interchangeable. Herein a consumed target (2) is replaced by a fresh and pre-sputtered target (7) thereby that the complete electrode (3) is replaced by a new electrode (6).

REFERENCES:
patent: 3616451 (1971-10-01), Gallez
patent: 3756939 (1973-09-01), Hurwitt
Solid State Technology, vol. 16, No. 12, Dec. 1, 1973, U.S., pp. 100-103, E. D. Segal: "New geometry in sputtering technology".
Patent Abstracts of Japan, vol. 10, No. 139 (C-348) (2196) May 22, 1986 and JP-A-60 262 969 (T.D.K. KK) Dec. 26, 1985 *Abstract*.
Vossen et al., "Thin Film Processes", Academic Press New York, 1978, pp. 41-42.

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