Sputtering target having a shrink fit mounting ring

Details Sputtering target having a shrink fit mounting ring Sputtering target having a shrink fit mounting ring

1995-12-22

1997-10-07

Weisstuch, Aaron

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

C23C 1434

Patent

active

056743670

ABSTRACT:
A target assembly for use in a sputtering system used for forming a thin film on a substrate is disclosed. The target assembly includes a mounting element having an interior wall which defines an aperture. The target assembly further includes a target for providing material for forming the film on the substrate. In particular, the target is affixed within the mounting element by an interference fit between the aperture and the target. Furthermore, the mounting ring includes a groove for holding an O-ring which serves to maintain a vacuum in the sputtering system.

REFERENCES:
patent: 4198283 (1980-04-01), Class et al.
patent: 5529673 (1996-06-01), Strauss et al.

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