Sputtering target for use in fabricating integrated circuit devi

Details Sputtering target for use in fabricating integrated circuit devi Sputtering target for use in fabricating integrated circuit devi

1990-11-20

1992-06-02

Weisstuch, Aaron

Superconductor technology: apparatus, material, process

High temperature , per se

Having tc greater than or equal to 150 k

20419215, 20419217, 20419221, 20419224, 20429813, 20429812, 505731, H01L 3924, C23C 1434

Patent

active

051186616

ABSTRACT:
A sputtering target for forming a thin film of an alloy on a substrate includes a first component having a first mass number and a second component having a second mass number larger than the first mass number. The weight percentage of the first component increases with depth from the surface of the target.

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