Sputtering target for phase-change memory, film for phase...

Metal founding – Process – Shaping liquid metal against a forming surface

Reexamination Certificate

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C164S076100

Reexamination Certificate

active

07484546

ABSTRACT:
The present invention provides a sputtering target for a phase change memory and a phase change memory film formed with such a target, and the manufacturing method thereof, characterized in that the sputtering target is composed from elements of not less than a three component system and has as its principal component one or more components selected from stibium, tellurium and selenium, and the compositional deviation in relation to the intended composition is ±1.0 at % or less. This sputtering target for a phase change memory is capable of reducing, as much as possible, impurities that cause the reduction in the number of times rewriting can be conducted as a result of such impurities segregating and condensing in the vicinity of the boundary face of the memory point and non-memory point; in particular, impurity elements that affect the crystallization speed, reducing the compositional deviation of the target in relation to the intended composition, and improving the rewriting properties and crystallization speed of a phase change memory by suppressing the compositional segregation of the target.

REFERENCES:
patent: 4842706 (1989-06-01), Fukasawa et al.
patent: 2007/0297938 (2007-12-01), Takahashi
patent: 62-114137 (1987-05-01), None
patent: 63-100632 (1988-05-01), None
patent: 3-162570 (1991-07-01), None
patent: 03-162570 (1991-07-01), None
patent: 5-47053 (1993-02-01), None
patent: 05-047053 (1993-02-01), None
patent: 5-155625 (1993-06-01), None
Unpublished Co-pending U.S. Appl. No. 11/722,218 (cited for consideration of Double Patenting Issues).
Unpublished Co-pending U.S. Appl. No. 11/813,694 (cited for consideration of Double Patenting Issues).

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