Sputtering target assemblies using resistance welding

Electric heating – Metal heating – For bonding with pressure

Reexamination Certificate

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Details

C204S298120, C219S091230, C219S093000

Reexamination Certificate

active

06992261

ABSTRACT:
A method of forming a sputtering target assembly and other metal articles is described. Sputtering target assemblies and metal articles are also described. The method includes bonding a sputter target to a backing plate using resistance heating or welding to bond assembly members that respectively include mating projections and grooves formed in bonding surfaces thereof.

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