Sputtering target and method for producing same

Specialized metallurgical processes – compositions for use therei – Compositions – Consolidated metal powder compositions

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

252518, 501134, C22C 2912

Patent

active

054358264

ABSTRACT:
A sputtering target having a relative density of 90% or more and a single-phase structure for forming a indium-tin oxide layer of low resistance is produced by pressing a composite powder of indium oxide and tin oxide having an average diameter of 0.1 .mu.m or less and a tin content controlled to 1.5-6 weight %; and sintering the pressed composite powder at 1500.degree.-1700.degree. C. in an oxygen atmosphere pressurized at 1-10 atm.

REFERENCES:
patent: 4962071 (1990-10-01), Bayard
patent: 5071800 (1991-12-01), Iwamoto et al.
patent: 5094787 (1992-03-01), Nakajima et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Sputtering target and method for producing same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Sputtering target and method for producing same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sputtering target and method for producing same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-737250

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.