Stock material or miscellaneous articles – All metal or with adjacent metals – Surface feature
Patent
1998-04-14
2000-11-28
Zimmerman, John J.
Stock material or miscellaneous articles
All metal or with adjacent metals
Surface feature
20419215, 20429812, 20429813, C23C 1434
Patent
active
061533157
ABSTRACT:
The surface roughness of a sputtering target is controlled and the amount of residual contaminants, the hydrogen content, and the thickness of a surface damage layer are reduced, in order to homogenize the thickness of a film formed on a substrate by sputtering and prevent and suppress nodule production to reduce particle production during sputtering. A sputtering target with the surface roughness (Ra) not more than 1.0 .mu.m, the total amount of contaminants, metal elements with a high melting point other than the major component and alloy components and Si, Al, Co, Ni, and B, not more that 500 ppm, the hydrogen content of the surface not more than 50 ppm, and the thickness of a surface damage layer not more than 50 .mu.m is provided, which is manufactured by precision machining, preferably, with the use of a diamond turning tool.
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Ishigami et al., "High Purity Ti Sputter Target for VLSIs", Toshiba Review, No. 161, pp. 38-41, Autumn 1987.
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Miyashita Hirohito
Seki Kazuhiro
Yamakoshi Yasuhiro
Japan Energy Corporation
Zimmerman John J.
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