Sputtering target and method for finishing surface of such...

Details Sputtering target and method for finishing surface of such... Sputtering target and method for finishing surface of such...

2011-05-31

2011-05-31

Nguyen, Nam X (Department: 1724)

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

C204S192120, C204S298310, C204S298320

Reexamination Certificate

active

07951275

ABSTRACT:
Provided is a hollow cathode sputtering target comprising an inner bottom face having a surface roughness of Ra≦1.0 μm, and preferably Ra≦0.5 μm. This hollow cathode sputtering target has superior sputter film evenness (uniformity), generates few arcing and particles, is capable of suppressing the peeling of the redeposited film on the bottom face, and has superior deposition characteristics.

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