Sputtering target and manufacturing method therefor, and...

Details Sputtering target and manufacturing method therefor, and... Sputtering target and manufacturing method therefor, and...

2006-11-20

2009-02-10

Mulvaney, Elizabeth (Department: 1794)

Stock material or miscellaneous articles

Circular sheet or circular blank

Recording medium or carrier

C428S064500, C430S270130, C204S192100

Reexamination Certificate

active

07488526

ABSTRACT:
To provide a sputtering target used for the formation of a recording layer of a recordable optical recording medium, wherein the sputtering target contains Bi and Fe and the packing density of the sputtering target is greater than 96%, and a recordable optical recording medium manufactured by using the sputtering target, which the recordable optical recording medium is capable of high-density recording even in the blue laser's wavelength range.

REFERENCES:
patent: 4405706 (1983-09-01), Takahashi et al.
patent: 6319368 (2001-11-01), Ide et al.
patent: 6610380 (2003-08-01), Kitaura et al.
patent: 6713148 (2004-03-01), Hsu et al.
patent: 6764736 (2004-07-01), Kitaura et al.
patent: 6933032 (2005-08-01), Sasa et al.
patent: 2005/0244753 (2005-11-01), Mishima et al.
patent: 2006/0003136 (2006-01-01), Sasa et al.
patent: 2-42899 (1990-09-01), None
patent: 2-265052 (1990-10-01), None
patent: 5-36142 (1993-02-01), None
patent: 6-184740 (1994-07-01), None
patent: 6-330297 (1994-11-01), None
patent: 7-90573 (1995-04-01), None
patent: 7-180045 (1995-07-01), None
patent: 8-67980 (1996-03-01), None
patent: 2578815 (1996-07-01), None
patent: 2769153 (1998-04-01), None
patent: 11-92922 (1999-04-01), None
patent: 11-193457 (1999-07-01), None
patent: 3098204 (2000-08-01), None
patent: 2000-264731 (2000-09-01), None
patent: 2002-208180 (2002-07-01), None
patent: 2003-3222 (2003-01-01), None
patent: 2003-048375 (2003-02-01), None
patent: 2005-108396 (2005-04-01), None
patent: 2006-97126 (2006-04-01), None

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