Sputtering target and manufacturing method therefor, and...

Details Sputtering target and manufacturing method therefor, and... Sputtering target and manufacturing method therefor, and...

2011-03-01

2011-03-01

Group, Karl E (Department: 1731)

Compositions: ceramic

Ceramic compositions

Refractory

C430S270120, C430S270130, C428S064400

Reexamination Certificate

active

07897535

ABSTRACT:
To provide a sputtering target for preparing a recordable optical recording medium characterized by comprising Bi and B and a manufacturing method thereof, a recordable high density optical recording medium using the sputtering target, and a sputtering target which is capable of improving a speed of the film formation for the improvement of productivity, which has a high intensity at the time of the film formation and which has a heightened packing density.

REFERENCES:
patent: 2004/0037203 (2004-02-01), Harigaya et al.
patent: 2005/0207331 (2005-09-01), Shinkai et al.
patent: 2010/0003446 (2010-01-01), Hayashi et al.
patent: 1372148 (2003-12-01), None
patent: 1566801 (2005-08-01), None
patent: 59-8618 (1984-01-01), None
patent: 59008618 (1984-01-01), None
patent: 63-162533 (1988-07-01), None
patent: 11-92922 (1999-04-01), None
patent: 2003-48375 (2003-02-01), None
patent: 2005-108396 (2005-04-01), None
patent: 2005-161831 (2005-06-01), None
patent: 2005-264206 (2005-09-01), None
patent: 2006-247897 (2006-09-01), None
patent: 460598 (2001-10-01), None
patent: 226907 (2005-01-01), None
patent: 200521258 (2005-07-01), None
Machine translation JP 2005264206, Sep. 2005.
Jan. 9, 2009 Chinese official action (and English translation thereof) in connection with a counterpart Chinese patent application No. 2007100856089.
Jul. 23, 2010 Taiwanese official action (including English translation) in connection with counterpart Taiwanese patent Application.
Nov. 22, 2010 Indian official action in connection with a counterpart Indian patent application.

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