Sputtering target and assembly

Details Sputtering target and assembly Sputtering target and assembly

1992-12-23

1994-11-22

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429817, 20429821, 20429813, C23C 1434

Patent

active

053666070

ABSTRACT:
A target assembly for use in a magnetron sputtering apparatus having a source of a magnetic field. The apparatus includes an annular sputtering target, and inner and outer poles surrounding the target, defining inner and outer confronting walls which extend beyond the target surface, for conducting magnetic flux across the target. These confronting walls are lined with inner and outer confronting target rings. The annual target and target rings may have different compositions, for use in forming sputtered films with a gradient composition.

REFERENCES:
patent: 4486287 (1984-12-01), Fournier
patent: 4626336 (1986-12-01), Bloomquist et al.
patent: 4933064 (1990-06-01), Geisler et al.
patent: 5004652 (1991-04-01), Lal et al.
patent: 5174880 (1992-12-01), Bourez et al.

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