Sputtering target

Details Sputtering target Sputtering target

1993-12-22

1995-05-16

Mai, Nguclan

Powder metallurgy processes

Powder metallurgy processes with heating or sintering

Powder shape or size characteristics

419 32, 419 33, 419 49, B22F 315

Patent

active

054158290

ABSTRACT:
A method of manufacturing metal silicide targets or alloy targets for sputtering use comprises the steps of (a) mechanically alloying silicon and a metal to provide a metal silicide powder or mechanically alloying silicon and a plurality of metal powders to provide an alloy powder, (b) and then pressing the metal silicide powder or alloy powder. The invention also relates to the metal silicide targets or alloy targets so manufactured. In the mechanical alloying step, rapid and fine division and agglomeration of the mixed powder is repeated until the particles of the material powders are finely divided to a submicron level. They form aggregates tens of microns in diameter. The aggregates gradually take an equi-axed shape. Homogenization of the material powder mixture progresses to mixing on the atomic level, until alloying takes place.

REFERENCES:
patent: 4663120 (1987-05-01), Parent et al.
patent: 4731116 (1988-03-01), Kuy
patent: 5160534 (1992-11-01), Hiraki
patent: 5294321 (1994-03-01), Satou et al.
patent: 5298338 (1994-03-01), Hiraki
patent: 5306569 (1994-04-01), Hiraki

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