Specialized metallurgical processes – compositions for use therei – Compositions – Consolidated metal powder compositions
Patent
1996-03-26
1998-04-07
Mai, Ngoclan
Specialized metallurgical processes, compositions for use therei
Compositions
Consolidated metal powder compositions
428 645, 428694MT, 428913, 420576, 43027013, C22C 2900
Patent
active
057366578
ABSTRACT:
A sputtering target contains a target material including as constituent elements Ag, In, Te and Sb with the respective atomic percents (atom. %) of .alpha., .beta., .gamma. and .delta. thereof being in the relationship of 0.5.ltoreq..alpha.<8, 5.ltoreq..beta..ltoreq.23, 17.ltoreq..gamma..ltoreq.38, 32.ltoreq..delta..ltoreq.73, .alpha..ltoreq..beta., and .alpha.+.beta.+.gamma.+.delta.=100, and a method of producing the above sputtering target is provided. An optical recording medium includes a recording layer containing a phase-change recording material which includes as constituent elements Ag, In, Te and Sb with the respective atomic percents of .alpha., .beta., .gamma. and .delta. thereof being in the relationship of 1.ltoreq..alpha.<6, 7.ltoreq..beta..ltoreq.20, 20.ltoreq..gamma..ltoreq.35, 35.ltoreq..delta..ltoreq.70, and .alpha.+.beta.+.gamma.+.delta.=100, and is capable of recording and erasing information by utilizing the phase change of the recording material in the recording layer. A method of forming the above recording layer for the optical recording medium is also provided. In addition, there is provided an optical recording method using the above-mentioned phase-change optical recording medium.
REFERENCES:
patent: 5011723 (1991-04-01), Harigaya et al.
patent: 5024927 (1991-06-01), Yamada et al.
patent: 5080947 (1992-01-01), Yamada et al.
patent: 5100700 (1992-03-01), Ide et al.
patent: 5156693 (1992-10-01), Ide et al.
patent: 5298305 (1994-03-01), Shinozuka et al.
patent: 5523140 (1996-06-01), Tominaga et al.
Deguchi Hiroshi
Harigaya Makoto
Ide Yukio
Iwasaki Hiroko
Kageyama Yoshiyuki
Mai Ngoclan
Ricoh & Company, Ltd.
LandOfFree
Sputtering target does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Sputtering target, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sputtering target will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-14708